DSH900
FEATURE SPECIFICATION GALLERY  

 

  

● High-end pro gaming memory module heat-spreaders.

● Dual duct and dual copper heat-pipe design for maximum performance.

● Stacked aluminum fins with maximum heat dissipation surface.  

● Superior aluminum body construction with anti-oxidation surface treatment.

●Advanced high density aluminum extrusion body, gloss silver anodized surface seal. Individually salt spray tested guaranteed not to color fade or oxidize. 

● Server grade glass-fiber thermal interface silicon pad for outstanding direct heat transfer.

 
 

Unique dual duct body construction with dual vacuum heat-pipe for optimum heat-transfer performance
 

Aluminum fin stack made from high density 0.6mm aluminum sheet. Maximizing and increasing total heat dissipating surface. 

 
  Easy screw mounted installation for solid stability. Direct heat-pipe to DRAM contact for instant heat transfer.
 

2 heat-spreader units per box, supports dual channel DRAM modules. 
 
 
 
  
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